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Thermal
Components, inc.
6-46-8, Higashi-Nippori,
Arakawa-ku, Tokyo 116-0014
mail=info@thermal.co.jp
Capital: JY 10 million
President: Sadao Yoshimura
Founded: January 1994
Commenced: February 1996
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Corporate
Mission |
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To
expand the network of small and mid-size
businesses, both domestic and overseas and
create new business opportunities, through
the restructuring of existing sales and
distribution systems and the development
of new markets. With minimum investment,
we will create the best combination of functions
(corporate/individual), according to the
requirements of the business cycle, in order
to compete in the global marketplace. |
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Main
Products |
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Business
Introduction |
Development,
manufacturing, and sales of heat sinks and related
accessories for electronic/communications equipment.
Ultra-lightweight heat sinks gFLUMINUMh, heat
sinks/ Miracle clips/Power clips for BGA/QFP,
clips & heat sinks for ZIF socket 5/7/370, heat
sinks & clips for Power PC G3/G4, NETi Internet
Service Provider for businesses and organizations,
management of the Industry Exchange Mall gAIDAh,
and promotion of the Industrial Network.
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Copyright(c) Thermal
Components, Inc. All rights reserved.
Unauthorized use or reproduction of materials contained is strictly
prohibited.
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